Pseudo-Translucent Integrated Circuit Package

ABSTRACT

An integrated circuit (IC) package includes at least one light source disposed together with an IC structure within an encapsulation structure. The material forming the encapsulation structure is generally opaque. Accordingly, the light source and at least a portion of the IC are not visible to the unaided human eye. The thickness and geometry of the encapsulation are such that when the light source is caused to emit light, the encapsulation structure permits at least a portion of that light to be visible to a user. The IC may be a portion of a fingerprint sensor, exposed for receiving a fingertip of a user. The light source, or a plurality of such light sources, may be functional (e.g., providing visual indication of the of the condition or state of an item of hardware or software, assist the user in operation of a device), be primarily aesthetic, or a combination thereof.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation-in-part of copending U.S.application for Letters Patent titled “Hybrid Multi-Sensor BiometricIdentification Device” Ser. No. 11/967,883, filed on Dec. 31, 2007,which, in its entirety, is hereby incorporated herein by reference andto which priority is claimed.

BACKGROUND

The present disclosure is related to integrated circuit packaging, andmore particularly to an integrated circuit package which includes alight source such as a light emitting diode or the like together with anintegrated circuit which are encapsulated in an opaque encapsulationmaterial such that when the light source emits light, at least some ofthat light may be seen on the surface of the opaque encapsulationmaterial.

Associating a light source with a semiconductor device is known in theart. The light source may serve a purely functional role, such as in anoptical fingerprint sensor, which uses the light source to illuminate aportion of a finger. In one example, the illuminated portion of thefinger is then examined and a fingerprint pattern captured therefrom.See U.S. Pat. No. 7,440,597, incorporated herein by reference.

Light sources associated with semiconductor packages may also have otheruses, such as providing a user with some sort of visual feedback duringoperation of a device. See, for example,www.validityinc.com/post.aspx?id=147. Another example is disclosed inU.S. Pat. No. 7,272,723, incorporated herein by reference, in which alight emitting diode (LED) provides a user with a visual indication ofthe operations being performed by a peripheral key management device. Inone embodiment of such a device, the light source is in electricalcommunication with a substrate which has electrical connection toprocessing hardware. The light source and substrate are enclosed withinthe interior of a partially translucent or transparent housing. As istypical for such devices, the housing is a structure molded prior tointroducing the substrate and LED. During assembly of the final device,the substrate and LED are secured within the pre-molded housing. Ingeneral, such devices are relatively large, and while electricallycoupled to the substrate, the light source is not mounted on or anintegral part thereof.

In general, there is great pressure on producers of integratedcircuit-based device to provide ever-more compact devices with a lowercost of manufacture. Silicon-based sensors, such as capacitivefingerprint sensors, are one such example. These silicon fingerprintsensing devices are commonly found in laptop computers, in PCperipherals such as keyboards and mice, in some models of cell phonesand personal digital assistance devices (PDAs) and so forth. The smallamount of space available for these devices mandates as much integrationof the components comprising the silicon fingerprint sensor as possible.And the supply chain model puts great pressure on device suppliers tolower costs.

Yet, there is also great pressure to innovate and introduce new featuresto provide product differentiation, ease of use, reliability and so on.One such feature in the area of silicon fingerprint sensors is anattractive device appearance. Another is a visual mechanism forproviding a user with feedback on device status and operation, such aswhere and when to swipe or place a finger over a sensor, whether a swipeor finger placement was successful, and so forth.

To date, there has not been available an IC package design whichprovides an attractive appearance, visual user feedback, and otherfunctionality of an illuminated integrated circuit package (again, ofwhich a capacitive fingerprint sensor is one example), while also beingof compact footprint, compatible with existing manufacturing techniques,materials, and tools, and which does not otherwise increase the cost ofdevice manufacturing more than the cost of the light source itself. Thepresent invention addresses these shortfalls.

SUMMARY

The present disclosure is directed to an integrated circuit (IC) packagewhich includes at least one light source such as a light emitting diode(LED) disposed therewith within an opaque encapsulation structure. Thematerial forming the encapsulation structure is of a type known in theart. The thickness and geometry of the encapsulation is such that whenthe light source is caused to emit light, the encapsulation materialpermits at least a portion of that light to be emitted, yet the unaidedeye (i.e., without equipment employed to view into an opaque structureor to view at a high level of magnification) is not able to see thephysical structure of the light source within the encapsulationstructure.

According to one aspect of the invention disclosed herein, the ICpackage includes a package base, an LED secured to the package base, anIC also secured to the package base, electrical interconnections betweenthe LED and the IC, and encapsulation material encapsulating the ICpackage base, the LED, the IC, and the connections between the LED andIC. In another embodiment, the LED is integrally formed within and formsa part of the IC, which together are disposed with the encapsulationmaterial.

According to another aspect of the invention disclosed herein, the ICpackage includes a package base, at least one LED secured to the packagebase, a silicon biometric sensor IC (including a sensor and relatedcircuitry) also secured to the package base, and connections carried bythe package base such that the LED(S) may be electrically controlleddirectly by the sensor IC circuitry or by other indirect or externalcircuitry. In a variation of this aspect of the invention, the biometricsensor is a capacitive fingerprint sensor, and the encapsulationmaterial is formed such that a portion of the sensor IC surface is leftminimally encapsulated or free of encapsulation material (i.e., anexposed sensor portion is formed in the encapsulation structure. Instill another variation, the encapsulation structure is formed to haveat least two opposingly disposed sidewalls at the periphery of theexposed sensor portion of a thickness and geometry such that a portionof the light emitted by the light source is caused to be visible on thesurface of the exposed sensor at least through a region of thosesidewalls.

In each exemplary embodiment of the present invention, a conventionalencapsulation material is used. Such traditional encapsulation materialsare typically considered opaque to the unaided human eye. However,thicknesses and geometries of the encapsulation structure are chosensuch that when the light source is caused to emit light, theencapsulation structure permits diffused light from the light source tobe visible on the surface of the encapsulation structure such that theencapsulation material appears translucent, and making visible to thehuman eye the light and the color of the light emitted by the lightsource. When the light source is not emitting light, the encapsulationmaterial retains its traditional opaque appearance, and the user is notable to see the light source (or any other components) encapsulatedtherein.

In certain exemplary embodiments, a single light source is disposedwithin the encapsulation structure. In other exemplary embodiments,multiple light sources are disposed within the encapsulation structure.In the case of multiple light sources, such light sources may each be ofthe same color, or two or more of the light sources may be of differentcolors. Furthermore, in certain embodiments the light source is an LED,while in other embodiments the light source is an alternate device type,such as an organic light emitting device (OLED), a low-power solid-statelaser, etc.

The light source so disposed can be used in a variety of applications toconvey to a user the condition of a device or other hardware or software(e.g., active of inactive), state condition of a device or otherhardware or software (e.g., ready for input or currently processinginput), visual cues as to expected or requested user action (e.g., arequest for a user to push a button or swipe a finger over a sensor),visual cues as to location of a portion of hardware to be activated orutilized (e.g., which button to push or where and when to slide afinger), visual feedback regarding the status of performance of steps ofa process and so forth. Different colors may be used to supplement orenhance the information (e.g., green light emitted for a successfulfingerprint scan and yellow light emitted for a failed fingerprintscan). It allows a human user to be provided with information about afunction(s) or apparatus based on lighting conditions such as“on”-“off”, blinking, dimming/brightening, unique sequence of flashes,colors, etc. Furthermore, the light emitted by the light source may bepurely aesthetic, or a combination of aesthetic and functional.

By embedding the light source in the encapsulating material, the lightsource is environmentally protected from harsh or corrosive conditionsand materials. Embedding the light source in the encapsulating materialsuch that light therefrom is visible only when it is illuminated resultsin a simpler, cleaner appearance which is more attractive to a user. Byemploying traditional opaque encapsulating materials as opposed tospecial transparent materials, special material and special equipmentcosts are eliminated, processing time is reduced, yield losses arereduced, and processing complexity is reduced.

The above is a summary of a number of the unique aspects, features, andadvantages of the present disclosure. However, this summary is notexhaustive. Thus, these and other aspects, features, and advantages ofthe present disclosure will become more apparent from the followingdetailed description and the appended drawings, when considered in lightof the claims provided herein.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings appended hereto like reference numerals denote likeelements between the various drawings. While illustrative, the drawingsare not drawn to scale. In the drawings:

FIG. 1 is a cut-away cross-sectional view of an integrated circuit (IC)package with integrally encapsulated light source where the light sourceis directly controlled by the integrated circuit according to anembodiment of the present invention.

FIG. 2 is a cut-away cross-sectional view of another integrated circuit(IC) package with integrally formed and integrally encapsulated lightsource according to another embodiment of the present invention.

FIG. 3 is a cut-away cross-sectional view of an integrated circuit (IC)package with integrally encapsulated light source and exposed IC surfaceof a type which may be used in a biometric sensor apparatus according toyet another embodiment of the present invention.

FIG. 4 is a cut-away cross-sectional view of an integrated circuit (IC)package with multiple integrally encapsulated light sources and exposedIC surface of a type which may be used in a biometric sensor apparatusaccording to still another embodiment of the present invention.

FIG. 5 is a plan view of the integrated circuit (IC) package withmultiple integrally encapsulated light sources and exposed IC surface ofa type which may be used in a biometric sensor apparatus according tothe embodiment illustrated in FIG. 4.

FIG. 6 is a is a cut-away side view of the integrated circuit (IC)package with multiple integrally encapsulated light sources and exposedIC surface of a type which may be used in a biometric sensor apparatusaccording to the embodiment illustrated in FIGS. 4 and 5, and is a viewperpendicular to the view shown in FIG. 4.

FIG. 7A is a perspective view of the integrated circuit (IC) packagewith multiple integrally encapsulated illuminated light sources andexposed IC surface of a type which may be used in a biometric sensorapparatus according to the embodiment illustrated in FIGS. 4 and 5,highlighting that light emitted by the light sources (but not the lightsources themselves) can be seen through the encapsulation structure.

FIG. 7B is a perspective view of the integrated circuit (IC) packagewith multiple integrally encapsulated light sources and exposed ICsurface of FIG. 7A, but with the light sources not illuminated,highlighting that the light sources cannot be seen through theencapsulation structure.

FIG. 8 is a perspective view of the integrated circuit (IC) package withmultiple integrally encapsulated illuminated light sources and exposedIC surface which includes a plurality of bezels for making electricalconnection to the finger being scanned, according to an embodiment ofthe present invention.

FIG. 9 is a cut-away cross-sectional view of an integrated circuit (IC)package with integrally encapsulated light source, where the lightsource is controlled by an external control element, according to anembodiment of the present invention.

FIG. 10 is a cut-away cross-sectional view of an integrated circuit (IC)package with integrally encapsulated light source, where the lightsource is indirectly controlled by the integrated circuit via theexternal control element, according to an embodiment of the presentinvention.

DETAILED DESCRIPTION

With reference to FIG. 1, there is shown therein a cross-sectional viewof an integrated circuit (IC) package 10 according to a first embodimentof the present invention. IC package 10 comprises an IC package base 12,having attached thereto, or alternatively having formed thereon, an IC14 (one such IC being shown, and it being understood that more than oneIC may also be included in such an IC package). IC package base 12 may,for example be an insulative fiberglass panel of the type commonly usedto form a printed circuit board (PCB). Wire bonds 15 (or otherconnection not shown) may be employed to make any required electricalinterconnections between electrical connections 18 formed on the surfaceof IC package base 12. In this example, IC package base 12 may be aprinted circuit board formed with patterned electrical connections 18for the specific purpose of receiving IC 14 and light source 16 (andpossibly other components.) The scope of the present invention is notintended to be limited by the operations performed by IC 14, although asdescribed further below in certain exemplary embodiments IC 14 may havespecific functionality. Thus, in this first embodiment IC 14 may performvirtually any function known or later developed in the art.

Also attached to IC package base 12, or alternatively formed therein, isa light source 16. In the embodiment shown, light source 16 is anotherwise well-known light emitting diode (LED), although the scope ofthe present invention is not intended to be limited by the structure normode of operation of light source 16. For example, light source 16 maybe a monochromatic, inorganic (crystalline)-based semiconductor LED(OLED). Light source 16 may be mounted within a housing and optionallymay have a dispersion lens integrally formed in the housing. Lightsource 16 (or the material encasing same) may produce light in one of avariety of colors, or multiple colors, or may optionally include aphosphor diffuser for white light emission. Light source 16 (or thematerial encasing same) may emit light in specific directions around theperiphery of the light source. Light source 16 may also be a solidstate, multiple quantum well heterostructure laser. Light source 16 maybe a complete, packaged device with interconnections, or may be a baredie (similar to an IC) which is electrically connected to IC 14 by wayof wire bonds 15, or by other indirect or external connection shown inFIG. 10 and FIG. 9 respectively.

Encapsulation structure 20 is formed over IC package base 12, IC 14,wire bonds 15, light source 16, and electrical interconnections 18. Thematerial forming encapsulation structure 20 may be a resin or plastic ofa type otherwise well known in the art. The encapsulation may beaccomplished by die molding or other techniques. A variety of diemolding techniques are well known in the art, such as disclosed in U.S.Pat. No. 5,049,526, which is incorporated herein by reference, and thusthe application of the encapsulation structure 20 is not furtherdiscussed herein.

Importantly, the thickness of the encapsulation structure over andaround light source 16 (e.g., the size of gap g between the point ofemission of light source 16 and an emission surface, such as top surface22 of encapsulation structure 20) determines the amount (intensity) oflight that may be seen by an unaided human eye through the encapsulationmaterial when light source 16 emits light (e.g., power is provided tolight source 16). Emission may be through top surface 22, side surface24, or other surface as described further below, provided gap g does notexceed a critical thickness to permit emission of light. In fact, as thegap g increases, the intensity of the light visible therethroughdecreases. Thus, different light intensities may be obtained by designfor different regions of encapsulation structure 20, from a single lightsource 16, by varying the thickness of the encapsulation material aboveand around light source 16.

The size of the gap which permits light emission through encapsulationstructure 20 will vary depending upon the type and intensity of thelight source 16), the type of material forming encapsulation structure20, the desired level of brightness of the visible light, and so forth.The size of the gap is, however, sufficiently large to hide the physicalsurfaces of light source 16 (and any other components such as IC 14)within the encapsulation structure. For illustrative purposes, gap g maybe on the order of 100 μm (microns). For a gap g of this size, whenlight source 16 is powered to emit light, a diffuse light can be seenthrough encapsulation structure 20, and when light source 16 is notpowered to emit light, light source 16 cannot be seen withinencapsulation structure 20. Light is visible through encapsulationstructure 20 when light source 16 is illuminated despite the fact thatthe encapsulation material is essentially opaque. For this reason, wealso refer to encapsulation structure 20 herein as beingpseudo-translucent.

An alternate embodiment of an IC package 26 is shown in cross-section inFIG. 2. As previously described, IC 14 and light source 16 were separateand discrete elements. According to the embodiment of FIG. 2, an IC 28is formed to have a light source 32 integrally formed therewith, therebyproviding an integrated IC and light source 34. This embodimentcontemplates that processing steps forming the active components of IC28 and processing steps forming light source 32 are either the same orare complementary. Encapsulation structure 36 is then formed overintegrated IC and light source 34, as previously described.

With reference next to FIG. 3, an IC package 40 according to yet anotherembodiment of the present invention is shown in cross-section. In thisembodiment, an IC 44 forms a component of a silicon biometric sensorapparatus, such as a capacitive fingerprint sensor. IC 44 is attached toIC package base 42, and interconnected with light source 46 by wire bond47 and interconnections 48. As is known, capacitive fingerprint sensorsoperate with the fingertip of the user located very close to if not incontact with the upper surface 50 of the sensor IC 44. Thus, anencapsulation structure 52 is formed such that a portion of uppersurface 50 of IC 44 is exposed or very thinly covered as compared to theencapsulation of the remainder of IC 44, light source 46, wire bond 47,and interconnections 48. This is a so-called “exposed die” encapsulatedstructure. Many techniques are known for producing an exposed dieencapsulated IC, such as that disclosed in U.S. Pat. No. 6,686,227,which is incorporated herein by reference. Thus, the precise method ofobtaining the exposed die is not a limitation on the scope of thepresent invention.

As is typical with the formation of an encapsulated IC with an exposedsurface portion, the encapsulation structure 52 defines a number ofsidewalls 54 which extend towards the exposed die surface. Typically,there are two such sidewall surfaces, positioned opposite one another onthe lateral edges of the exposed die surface. Sidewalls 54 form thechannel within which a finger is placed or slid in the process ofscanning for a fingerprint pattern or the locators for a finger when anon-scanning biometric sensor is used.

There are a number of applications in which it is desirable toilluminate a portion of or draw attention to a portion of the exposeddie surface, such as to indicate to a user where to swipe or position afinger in using the fingerprint sensor. (As the present inventionapplies equally to strip sensor and area sensor devices, swiping afinger in the case of a strip sensor and placing a finger in the case ofan area sensor are collectively referred to herein as presenting afinger.) Therefore, in one embodiment a gap s is formed between thepoint of emission of light source 46 and the surface of sidewall 54 suchthat light from light source 46 may be seen by the human eye emittingfrom sidewall 54. Thickness and geometries may be adjusted such thatlight preferentially or exclusively emits from sidewall 54, orconversely emits from sidewall 54 with a reduced intensity as comparedto top surface 56 of encapsulation structure 52.

Furthermore, light source 46 may be a directional light source, such asa side-emitting LED, positioned such that light therefrom is directedtoward sidewall 54 for preferential lighting at the surface of sidewall54. Light source 46 may also be tilted toward a surface for preferentiallight output. Yet another way to obtain preferential lighting throughsidewall 54 is to apply a coating (not shown) over the topmost surface56 of encapsulation structure 52 to reduce the amount of light thatexits through that surface.

The description above and accompanying figures have thus far illustrateda single light source disposed adjacent the IC within the encapsulationstructure. With reference next to the embodiment 58 shown in FIG. 4, itcan be seen and appreciated that in any of the foregoing embodiments, anarbitrary number of light sources may be placed virtually anywherearound the periphery of IC 62, such as the placement of light sources 74and 76 (and light sources 70 and 72 of FIG. 5 discussed further below).Alternatively or in addition, IC 62 can be formed with light sourceswithin its periphery (not shown), so that light may exit theencapsulation structure at virtually any desired location.

With reference to FIG. 5 which is a top or plan-view of embodiment 58 ofthe present invention shown in FIG. 4, it can be seen that light sources70, 72, 74, and 76 have be placed in desired locations around theperiphery of IC 62 (which is not visible to the human eye within theencapsulation structure 68, apart from the exposed portion 64 of sensorIC 62). In this embodiment, the structure is used as a siliconfingerprint sensor such as a capacitive fingerprint sensor. As is wellknown for such devices, a finger is swiped in the direction of arrow Awhich results in a plurality of image strips being captured for analysis(such as verification against a database of registered fingerprints).Light sources 74 and 76 may be illuminated to provide a visual feedbackto a user as to the location of the exposed portion 64 of sensor IC 62so that the user's finger may be properly aligned. Light sources 70 and72 may be operated in sequence so that a user is provided with visualfeedback as to how to present the finger (e.g., which direction to swipea finger in the case of a strip sensor). These uses for light sources70-76 are merely exemplary, and in no way limit the scope of theinvention described and claimed here.

FIG. 6 is a cut-away side view of the embodiment 58 shown in FIGS. 4 and5, and is a view perpendicular to the view shown in FIG. 4. In the viewshown in FIG. 6, the position and relationship of light sources 70 and72 relative to IC 62 can be seen. As previously discussed, the positionof the light sources, the number of such light sources, the type andmode of operation of the light sources, the color of light the lightsources emit, etc. may be varied depending on the application of theinvention disclosed herein. Furthermore, the thickness and geometry(e.g., forming local non-plan regions) of the encapsulation structure 68encapsulating the light sources may be controlled to obtain a desiredlight intensity of light to be seen by the human eye at theencapsulation structure surface to be viewed by a user.

With reference to FIGS. 7A and 7B which are perspective views of theembodiment 58 of the present invention shown in FIGS. 4, 5, and 6, the“on” and “off”-states of light sources 70-76 are illustrated. In FIG.7A, all light sources 70-76 are in an operating state (i.e., current isapplied to the terminals thereof so as to cause the light sources toemit light). In this state, light emits at the surface of encapsulationstructure 68, preferably such that the physical surface of the lightsources are not visible through the encapsulation material. However, asillustrated in FIG. 7B, when light sources 70-76 are not in an operatingstate the physical surface of the light sources are not visible throughthe encapsulation material. Indeed, there is otherwise no clue thatthere are in fact light sources forming a part of the structure ofembodiment 58, and the structure appears otherwise as a typicalencapsulated capacitive fingerprint sensor structure, with all of theequivalent properties and characteristics of an encapsulating structurewhich does not contain a light source.

With reference next to FIG. 8, there is shown therein another embodiment90 of the present invention. The elements of embodiment 90 are the sameas those of embodiment 58, and hence the same reference numbers are usedtherein, with the exception of the addition of a bezel structurecomprised of conductive bezel plates 92, 94. In certain embodiments of afingerprint sensor it is desirable to make electrical connection betweenthe finger being scanned and the sensor IC 64. One method of making thiselectrical connection to the finger is to provide proximate the sensorIC conductive bezels such as 92 and 94, which are formed of a conductiveand environmentally robust material such as stainless steel. Thematerial forming such bezels is often very opaque, with a density thatpermits little if any light from light sources 70, 72 to passtherethrough. However, with the proper choice of thicknesses, placementof light sources 70, 72, etc., light from light sources 70, 72 can exitunder and around bezels 92, 94, as illustrated. Indeed, this may beviewed as an advantage in that by locating bezels 92, 94 at or near thesurface of encapsulation structure 68, light may be directed by bezels92, 94 to their edges axial to the direction of finger motion. Thisallows the desired visual feedback, aesthetic appearance,differentiation, etc. discussed above despite the presence of opaquebezels 92, 94.

Accordingly, the present invention uses traditional materials, tools,and processes to manufacture an IC packages with concealed lightsources. Other than the cost of the LED(s) and the cost to mount them,there is no other additional cost of materials or manufacture ascompared conventional IC packages. Additional yield losses andadditional manufacturing steps and cycle time are both minimized.

While a plurality of preferred exemplary embodiments have been presentedin the foregoing detailed description, it should be understood that avast number of variations exist, and these preferred exemplaryembodiments are merely representative examples, and are not intended tolimit the scope, applicability or configuration of the disclosure in anyway.

Referring again to FIG. 1, light source 16 is shown in direct,electrical communication with IC 14. Accordingly, IC 14 can control theoperation of light source 16. However, other embodiments for controllingthe operation of light source 16 are within the scope of the presentinvention. One such embodiment 100 is illustrated in FIG. 9. Accordingto this embodiment, IC 14 and light source 16 are not in directelectrical communication with one another. Rather, control element 102(passive or active) communicates with light source 16 by means ofconductive via 104 or other connection mechanism. According to thisembodiment, control element 102 is shown separate from the integratedcircuit package containing IC 14 and light source 16 withinencapsulation structure 20. In this instance, control element 102 may bean element of a system into which embodiment 100 is ultimatelyinstalled, such as a personal computer, cellular telephone, PDA, etc.Control element 102 may alternatively be an element, discrete andseparate from IC 14 and light source 16, contained within the integratedcircuit package. In either case, IC 14 does not play a role in thecontrol of light source 16, so that control of light source 16 isexternal to IC 14.

In still another embodiment 110 of an integrated circuit packageillustrated in FIG. 10, IC 14 and light source 16 are connected tocontrol element 112 by means of vias 114, 116, respectively. Controlelement 112 is once again shown separate from the integrated circuitpackage, but may be a discrete, separate element therein in appropriateapplications. According to embodiment 110, IC 14 is electrically coupledto and at least partially controlling control element 112, which in turncontrols light source 16. In this way, IC 14 indirectly controls theoperation of light source 16 via control element 112.

The present invention lends itself to many different applications. Oneexemplary embodiment described above is the exposed surfacecapacitive-type strip fingerprint sensor. However, this is simply one ofmany such applications. Other equally viable applications in thebiometric sensor area include so-called area sensors (in which a fingeris positioned in place over the sensor during scanning), non-capacitivesensors (e.g., thermal or optical sensors), retinal scan sensors, and soforth. Importantly, biometric sensing is just one area of application ofthe present invention. Any application in which visual cues, feedback,or aesthetics are desired while minimizing device size, cost, anddeparture from known materials and processes may benefit from thepresent invention. Accordingly, it is not practicable to list allpossible applications herein. Thus, several embodiments are illustratedabove, and one skilled in the art will appreciate other applications asappropriate.

Furthermore, various presently unforeseen or unanticipated alternatives,modifications variations, or improvements therein or thereon may besubsequently made by those skilled in the art which are also intended tobe encompassed by the claims, below.

Therefore, the foregoing description provides those of ordinary skill inthe art with a convenient guide for implementation of the disclosure,and contemplates that various changes in the functions and arrangementsof the described embodiments may be made without departing from thespirit and scope of the disclosure defined by the claims thereto.

1. An integrated circuit package comprising: an integrated circuitstructure; a light source; a generally opaque encapsulation material,encapsulating at least a portion of said integrated circuit structureand said light source such that said light source and at least a portionof said integrated circuit structure are not visible to the unaidedhuman eye, and further such that when said light source is caused toemit light, the light so emitted is visible to the unaided human eyethrough at least a portion of said opaque encapsulation material.
 2. Theintegrated circuit package of claim 1, wherein said light source iselectrically coupled to said integrated circuit structure.
 3. Theintegrated circuit package of claim 1, wherein said light source iselectrically coupled to and at least partially controlled by a deviceexternal to said integrated circuit package.
 4. The integrated circuitpackage of claim 1, wherein said light source is electrically coupled toa device external to said integrated circuit package, said deviceelectrically coupled to said integrated circuit structure.
 5. Theintegrated circuit package of claim 1, wherein said light source isselected from the group consisting of: a light emitting diode, anorganic light emitting diode, and a solid state laser.
 6. The integratedcircuit package of claim 1, where said light source forms a part of saidintegrated circuit structure.
 7. The integrated circuit package of claim1, further comprising a plurality of light sources encapsulated in saidencapsulation material such that they are not visible to the unaidedhuman eye, and further such that when said light sources are caused toemit light, the light so emitted is visible to the unaided human eyethrough at least a portion of said opaque encapsulation material.
 8. Theintegrated circuit package of claim 7, wherein at least two of saidplurality of light sources each emit light of a different color suchthat said light so emitted is visible to the unaided human eye throughat least a portion of said opaque encapsulation material.
 9. Theintegrated circuit package of claim 7, wherein said light sources areelectrically connected to and controlled by circuitry for causing saidlight sources to emit light in patterns indicative of at least one itemfrom the group consisting of: condition of an item of hardware,condition of an item of software, state condition of an item ofhardware, state condition of an item of software, visual cues as toexpected user action, visual cues as to requested user action, visualcues as to location of a portion of hardware to be activated, and visualfeedback regarding the status of performance of steps of a process. 10.An integrated circuit package comprising: an integrated circuitstructure, comprising: a silicon fingerprint sensor structure; a lightsource; a generally opaque encapsulation material, encapsulating atleast a portion of said integrated circuit structure and said lightsource such that said light source and at least a portion of saidintegrated circuit structure are not visible to the unaided human eye,and further such that when said light source is caused to emit light,the light so emitted is visible to the unaided human eye through atleast a portion of said opaque encapsulation material.
 11. Theintegrated circuit package of claim 10, wherein said light source iselectrically coupled to said integrated circuit structure.
 12. Theintegrated circuit package of claim 10, wherein said light source iselectrically coupled to and at least partially controlled by a deviceexternal to said integrated circuit package.
 13. The integrated circuitpackage of claim 12, wherein said light source is electrically coupledto a device external to said integrated circuit package said deviceelectrically coupled to said integrated circuit structure.
 14. Theintegrated circuit package of claim 10, wherein said light source isselected from the group consisting of: a light emitting diode, anorganic light emitting diode, and a solid state laser.
 15. Theintegrated circuit package of claim 10, where said light source forms apart of said integrated circuit structure.
 16. The integrated circuitpackage of claim 10, further comprising a plurality of light sourcesencapsulated in said encapsulation material such that they are notvisible to the unaided human eye, and further such that when said lightsources are caused to emit light, the light so emitted is visible to theunaided human eye through at least a portion of said opaqueencapsulation material.
 17. The integrated circuit package of claim 16,wherein at least two of said plurality of light sources each emit lightof a different color such that said light so emitted is visible to theunaided eye through at least a portion of said opaque encapsulationstructure.
 18. The integrated circuit package of claim 16, wherein saidlight sources are electrically connected to and controlled by circuitryfor causing said light sources to emit light in patterns indicative ofat least one item from the group consisting of: condition of an item ofhardware, condition of an item of software, state condition of an itemof hardware, state condition of an item of software, visual cues as toexpected user action, visual cues as to requested user action, visualcues as to location of a portion of hardware to be activated, and visualfeedback regarding the status of performance of steps of a process. 19.The integrated circuit package of claim 17, wherein said light sourcesemit light in patterns indicative of visual cues as to expected useraction selected from the group consisting of: an indication that theintegrated circuit package is ready for presentation of a user's finger,a sensed fingerprint matches a stored fingerprint pattern, a user'sfinger was insufficiently or incorrectly presented, and a sensedfingerprint does not match a stored fingerprint pattern. 20 Theintegrated circuit package of claim 10, wherein said encapsulationstructure defines an exposed sensor region within which a portion ofsaid silicon fingerprint sensor structure is visibly within saidencapsulation material to the unaided human eye.
 21. The integratedcircuit package of claim 20, wherein said silicon fingerprint sensorstructure is a capacitive fingerprint sensor.
 22. The integrated circuitpackage of claim 20, wherein the thicknesses and geometries of regionsof said encapsulation material are chosen such that light emitted bysaid light source and visible at a first region of said encapsulationmaterial is intentionally of a different intensity than the lightemitted by said light source and visible at a second region of saidencapsulation material.
 23. The integrated circuit package of claim 20,wherein said exposed sensor region is defined by sidewalls extendingdownward from a top surface of said encapsulation material to a positionproximate said silicon fingerprint sensor structure, and further whereinsaid light source is positioned relative to at least one of saidsidewalls such that when said light source is caused to emit light, atleast a portion of the light so emitted is visible to the unaided humaneye through at least a portion of said at least one of said sidewalls,and still further wherein said light source is not visible to theunaided human eye through said sidewall.
 24. The integrated circuitpackage of claim 23, wherein said light sources are encapsulated in saidencapsulation material such that they are not visible to the unaidedhuman eye, and further wherein at least two of said light sources areeach positioned relative to a corresponding one of said sidewalls suchthat when each said light source is caused to emit light, at least aportion of the light so emitted is visible to the unaided human eyethrough at least a portion of said sidewall corresponding to said lightsource, and still further wherein said light sources are not visible tothe unaided human eye through said sidewalls.